Invention Grant
- Patent Title: Semiconductor device and method for manufacturing same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13807555Application Date: 2011-06-30
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Publication No.: US08946786B2Publication Date: 2015-02-03
- Inventor: Goro Nakatani
- Applicant: Goro Nakatani
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2010-151147 20100701; JP2010-155185 20100707
- International Application: PCT/JP2011/065111 WO 20110630
- International Announcement: WO2012/002514 WO 20120105
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L25/07 ; B81C1/00 ; G01P15/08 ; G01P15/125 ; H01L27/092 ; H01L21/50 ; H01L27/06 ; G01C19/5733 ; G01C19/5769

Abstract:
A semiconductor substrate of a semiconductor device has a sensor region and an integrated circuit region, and a cavity is formed immediately under a surface layer portion of the sensor region. A capacitive acceleration sensor is formed on the sensor region by working a surface layer portion of the semiconductor substrate opposed to the cavity. The capacitive acceleration sensor includes an interdigital fixed electrode and an interdigital movable electrode. A CMIS transistor is formed on the integrated circuit region. The CMIS transistor includes a P-type well region and an N-type well region formed on the surface layer portion of the semiconductor substrate. A gate electrode is opposed to the respective ones of the P-type well region and the N-type well region through a gate insulating film formed on a surface of the semiconductor substrate.
Public/Granted literature
- US20130099292A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2013-04-25
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