Invention Grant
- Patent Title: Finfet with reduced parasitic capacitance
- Patent Title (中): Finfet具有降低的寄生电容
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Application No.: US13600314Application Date: 2012-08-31
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Publication No.: US08946791B2Publication Date: 2015-02-03
- Inventor: Veeraraghavan S. Basker , Effendi Leobandung , Tenko Yamashita
- Applicant: Veeraraghavan S. Basker , Effendi Leobandung , Tenko Yamashita
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Joseph P. Abate, Esq.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/336

Abstract:
A gate dielectric and a gate electrode are formed over a plurality of semiconductor fins. An inner gate spacer is formed and source/drain extension regions are epitaxially formed on physically exposed surface of the semiconductor fins as discrete components that are not merged. An outer gate spacer is subsequently formed. A merged source region and a merged drain region are formed on the source extension regions and the drain extension regions, respectively. The increased lateral spacing between the merged source/drain regions and the gate electrode through the outer gate spacer reduces parasitic capacitance for the fin field effect transistor.
Public/Granted literature
- US20140061734A1 FINFET WITH REDUCED PARASITIC CAPACITANCE Public/Granted day:2014-03-06
Information query
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