Invention Grant
- Patent Title: Packaging for semiconductor sensor devices and methods
- Patent Title (中): 半导体传感器装置和方法的封装
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Application No.: US13657250Application Date: 2012-10-22
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Publication No.: US08946833B2Publication Date: 2015-02-03
- Inventor: Leo M. Higgins, III
- Applicant: Leo M. Higgins, III
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L29/84
- IPC: H01L29/84
Abstract:
A pressure sensor includes a first housing having a cavity. The pressure sensor further includes a pressure sensing device attached to a bottom of the cavity. The pressure sensor further includes a layer of gel over the pressure sensing device. The pressure sensor further includes a baffle in contact with the gel to reduce movement of the gel.
Public/Granted literature
- US20140110801A1 PACKAGING FOR SEMICONDUCTOR SENSOR DEVICES AND METHODS Public/Granted day:2014-04-24
Information query
IPC分类:
