Invention Grant
US08946852B2 Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or photosensitive resin composition film
有权
感光性树脂组合物，感光性树脂组合物膜和使用该感光性树脂组合物或感光性树脂组合物膜的半导体装置
- Patent Title: Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or photosensitive resin composition film
- Patent Title (中): 感光性树脂组合物，感光性树脂组合物膜和使用该感光性树脂组合物或感光性树脂组合物膜的半导体装置
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Application No.: US13807210Application Date: 2011-06-10
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Publication No.: US08946852B2Publication Date: 2015-02-03
- Inventor: Hiroyuki Niwa
- Applicant: Hiroyuki Niwa
- Applicant Address: JP Tokyo
- Assignee: Toray Industries, Inc.
- Current Assignee: Toray Industries, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Ratnerprestia
- Priority: JP2010-151596 20100702
- International Application: PCT/JP2011/063339 WO 20110610
- International Announcement: WO2012/002134 WO 20120105
- Main IPC: G03F7/023
- IPC: G03F7/023 ; H01L23/00 ; H01L23/29
Abstract:
A photosensitive resin composition contains: (a) an alkali-soluble polyimide; (b) a compound which has two or more epoxy groups and/or oxetanyl groups in each molecule; and (c) a quinonediazide compound. Less than 10 parts by weight of an acrylic resin is contained per 100 parts by weight of the polyimide (a); and the content of the compound (b) is not less than 20 parts by weight per 100 parts by weight of the polyimide (a).
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