Invention Grant
US08946857B2 Semiconductor device for effectively disperse heat generated from heat generating device
有权
用于有效地分散由发热装置产生的热量的半导体装置
- Patent Title: Semiconductor device for effectively disperse heat generated from heat generating device
- Patent Title (中): 用于有效地分散由发热装置产生的热量的半导体装置
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Application No.: US13303313Application Date: 2011-11-23
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Publication No.: US08946857B2Publication Date: 2015-02-03
- Inventor: Mitsuaki Igeta , Takashi Suzuki
- Applicant: Mitsuaki Igeta , Takashi Suzuki
- Applicant Address: JP Kawasaki JP Yokohama
- Assignee: Fujitsu Limited,Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Limited,Fujitsu Semiconductor Limited
- Current Assignee Address: JP Kawasaki JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L23/367 ; H01L23/522
Abstract:
A semiconductor device includes a semiconductor substrate, a heat generating device, and a heat radiating part. The heat generating device is provided on the semiconductor substrate, and the heat radiating part is provided above the heat generating device. The heat radiating part is thermally coupled with the semiconductor substrate through at least one contact part.
Public/Granted literature
- US20120068308A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCTION METHOD Public/Granted day:2012-03-22
Information query
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