Invention Grant
- Patent Title: Microelectronic substrate having removable edge extension element
- Patent Title (中): 具有可移除边缘延伸元件的微电子基板
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Application No.: US13490239Application Date: 2012-06-06
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Publication No.: US08946866B2Publication Date: 2015-02-03
- Inventor: Charles W. Koburger, III , Steven J. Holmes , David V. Horak , Kurt R. Kimmel , Karen E. Petrillo , Christopher F. Robinson
- Applicant: Charles W. Koburger, III , Steven J. Holmes , David V. Horak , Kurt R. Kimmel , Karen E. Petrillo , Christopher F. Robinson
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Yuanmin Cai; Ira D. Blecker
- Main IPC: H01L29/06
- IPC: H01L29/06 ; G03F7/20

Abstract:
An article including a microelectronic substrate is provided as an article usable during the processing of the microelectronic substrate. Such article includes a microelectronic substrate having a front surface, a rear surface opposite the front surface and a peripheral edge at boundaries of the front and rear surfaces. The front surface is a major surface of the article. A removable annular edge extension element having a front surface, a rear surface and an inner edge extending between the front and rear surfaces has the inner edge joined to the peripheral edge of the microelectronic substrate. In such way, a continuous surface is formed which includes the front surface of the edge extension element extending laterally from the peripheral edge of the microelectronic substrate and the front surface of the microelectronic substrate, the continuous surface being substantially co-planar and flat where the peripheral edge is joined to the inner edge.
Public/Granted literature
- US20120241913A1 MICROELECTRONIC SUBSTRATE HAVING REMOVABLE EDGE EXTENSION ELEMENT Public/Granted day:2012-09-27
Information query
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