Invention Grant
- Patent Title: Semiconductor package including cap
- Patent Title (中): 半导体封装包括盖
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Application No.: US12893044Application Date: 2010-09-29
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Publication No.: US08946877B2Publication Date: 2015-02-03
- Inventor: Rick Snyder , Joel Philliber
- Applicant: Rick Snyder , Joel Philliber
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L31/0203 ; H01L31/102 ; H01L29/66 ; H01L23/06 ; H01L23/12 ; H01L23/00 ; H01L23/10
Abstract:
A semiconductor package comprises: a substrate comprising a semiconductor device; a cap comprising a seal ring disposed over a surface of the cap; and a gap between the substrate and the surface of the cap. The seal ring comprises a tread comprising at least two columns.
Public/Granted literature
- US20120074555A1 SEMICONDUCTOR PACKAGE INCLUDING CAP Public/Granted day:2012-03-29
Information query
IPC分类:
