Invention Grant
US08946879B2 Packages and methods for 3D integration including two stacked dies with a portion of one die extending into a hole of the other die
有权
用于3D集成的包装和方法，包括两个堆叠的模具，其中一个模具的一部分延伸到另一个模具的孔中
- Patent Title: Packages and methods for 3D integration including two stacked dies with a portion of one die extending into a hole of the other die
- Patent Title (中): 用于3D集成的包装和方法，包括两个堆叠的模具，其中一个模具的一部分延伸到另一个模具的孔中
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Application No.: US13560855Application Date: 2012-07-27
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Publication No.: US08946879B2Publication Date: 2015-02-03
- Inventor: Thomas Goida
- Applicant: Thomas Goida
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/367 ; H01L23/538
Abstract:
Packages and methods for 3D integration are disclosed. In various embodiments, a first integrated device die having a hole is attached to a package substrate. A second integrated device die can be stacked on top of the first integrated device die. At least a portion of the second integrated device die can extend into the hole of the first integrated device die. By stacking the two dies such that the portion of the second integrated device die extends into the hole, the overall package height can advantageously be reduced.
Public/Granted literature
- US20140027867A1 PACKAGES AND METHODS FOR 3D INTEGRATION Public/Granted day:2014-01-30
Information query
IPC分类:
