Invention Grant
US08946880B2 Packaged semiconductor device having multilevel leadframes configured as modules
有权
具有被配置为模块的多级引线框的封装半导体器件
- Patent Title: Packaged semiconductor device having multilevel leadframes configured as modules
- Patent Title (中): 具有被配置为模块的多级引线框的封装半导体器件
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Application No.: US13848771Application Date: 2013-03-22
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Publication No.: US08946880B2Publication Date: 2015-02-03
- Inventor: Richard J. Saye
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Frederick J. Telecky, Jr.
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/495 ; H01L21/56 ; H01L23/00 ; H01L23/31
Abstract:
A semiconductor system (100) has a first planar leadframe (101) with first leads (102) and pads (103) having attached electronic components (120), the first leadframe including a set of elongated leads (104) bent at an angle away from the plane of the first leadframe; a second planar leadframe (110) with second leads (112) and pads (113) having attached electronic components (114); the bent leads of the first leadframe conductively connected to the second leadframe, forming a conductively linked 3-dimensional network between components and leads in two planes; and packaging material (140) encapsulating the 3-dimensional network.
Public/Granted literature
- US20130249051A1 Packaged Semiconductor Device Having Multilevel Leadframes Configured as Modules Public/Granted day:2013-09-26
Information query
IPC分类:
