Invention Grant
- Patent Title: Semiconductor module and semiconductor device
- Patent Title (中): 半导体模块和半导体器件
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Application No.: US13799787Application Date: 2013-03-13
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Publication No.: US08946882B2Publication Date: 2015-02-03
- Inventor: Chikage Kato , Yoshiyuki Yamauchi
- Applicant: Denso Corporation
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye PC
- Priority: JP2012-058219 20120315
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/373 ; H01L23/427 ; H01L23/433 ; H01L25/07 ; H01L23/051 ; H01L23/498
Abstract:
A semiconductor module includes at least one intermediate plate which has heat conductivity, power semiconductor elements which are provided for respective main surfaces of the intermediate plate, heat sinks which are arranged so that the power semiconductor elements are held between the heat sinks and the intermediate plate, and a mold part which seals the intermediate plate, the power semiconductor elements, and the heat sinks with mold resin. Surfaces of the heat sinks opposite to the side of the power semiconductor elements are exposed from the mold part. The intermediate plate has an intermediate radiator which projects in the direction parallel to the main surface from the mold part.
Public/Granted literature
- US20130241043A1 SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE Public/Granted day:2013-09-19
Information query
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