Invention Grant
- Patent Title: Semiconductor arrangement and method for producing a semiconductor arrangement
- Patent Title (中): 用于制造半导体装置的半导体装置和方法
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Application No.: US13063652Application Date: 2009-07-13
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Publication No.: US08946885B2Publication Date: 2015-02-03
- Inventor: Andreas Krauss
- Applicant: Andreas Krauss
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Maginot, Moore & Beck LLP
- Priority: DE102008042035 20080912
- International Application: PCT/EP2009/058924 WO 20090713
- International Announcement: WO2010/028880 WO 20100318
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/15 ; H01L23/492
Abstract:
A semiconductor arrangement includes a ceramic mount and at least one semiconductor component fixed-to the ceramic mount. The ceramic mount includes a first section, and the first section is electrically conductive.
Public/Granted literature
- US20110180810A1 Semiconductor Arrangement and Method for Producing a Semiconductor Arrangement Public/Granted day:2011-07-28
Information query
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