Invention Grant
- Patent Title: Inspecting method and program for object to be inspected
- Patent Title (中): 检查对象的检查方法和程序
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Application No.: US12512448Application Date: 2009-07-30
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Publication No.: US08947114B2Publication Date: 2015-02-03
- Inventor: Hideaki Tanaka
- Applicant: Hideaki Tanaka
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-198023 20080731
- Main IPC: G01R31/20
- IPC: G01R31/20 ; G01R31/28

Abstract:
An inspecting method for an object to be inspected is provided to bring probes of a probe card into electrical contact with a predetermined number of devices of target devices of the object at a time to inspect electrical characteristics of the target devices by moving a mounting table for mounting thereon the object under the control of a control unit. Upon completion of the inspection of the target devices, if inspection errors have occurred in specific devices of the target devices in a regular pattern, the target devices are re-examined, and when the re-examination is carried out, a contact position between the probe card and the object is displaced from a contact position in a previous inspection by a distance of at least one device to inspect electrical characteristics of the number of devices of the target devices at a time.
Public/Granted literature
- US20100026328A1 INSPECTING METHOD AND PROGRAM FOR OBJECT TO BE INSPECTED Public/Granted day:2010-02-04
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