Invention Grant
US08947177B2 Coupling mechanism for a PCB mounted microwave re-entrant resonant cavity 有权
用于PCB安装的微波入侵谐振腔的耦合机构

  • Patent Title: Coupling mechanism for a PCB mounted microwave re-entrant resonant cavity
  • Patent Title (中): 用于PCB安装的微波入侵谐振腔的耦合机构
  • Application No.: US13702372
    Application Date: 2011-06-21
  • Publication No.: US08947177B2
    Publication Date: 2015-02-03
  • Inventor: Titos Kokkinos
  • Applicant: Titos Kokkinos
  • Applicant Address: FR Boulogne-Billancourt
  • Assignee: Alcatel Lucent
  • Current Assignee: Alcatel Lucent
  • Current Assignee Address: FR Boulogne-Billancourt
  • Agency: Harness, Dickev & Pierce
  • Priority: EP10305699 20100629
  • International Application: PCT/EP2011/060266 WO 20110621
  • International Announcement: WO2012/000822 WO 20120105
  • Main IPC: H01P1/202
  • IPC: H01P1/202 H01P7/04 H01R12/71 H01P1/205 H01P1/208
Coupling mechanism for a PCB mounted microwave re-entrant resonant cavity
Abstract:
The microwave signals are coupled from a transmission line embedded in a Printed Circuit Board PCB to a resonant cavity mounted on an external metalized surface of this PCB. The coupling mechanism implements an easy-to-fabricate mechanism leading to high-quality filtering owing to the fact that the end of the transmission line is provided with a metalized feeding pad located at the external layer of the PCB inside the resonant cavity. The resonant cavity is provided with a re-entrant inner stub orthogonal to the PCB and separated from the PCB by a capacitive gap. The metalized feeding pad is facing the inner stub in the area of the capacitive gap and is offset from the axial direction of this inner stub. The metalized feeding pad is further separated from the external metalized surface of the PCB by a surface capacitive gap.
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