Invention Grant
- Patent Title: Multilayer chip inductor and production method for same
- Patent Title (中): 多层片式电感及其制作方法相同
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Application No.: US13991690Application Date: 2011-10-19
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Publication No.: US08947189B2Publication Date: 2015-02-03
- Inventor: Yoshikazu Maruyama , Masataka Kohara , Kazuhiko Oyama
- Applicant: Yoshikazu Maruyama , Masataka Kohara , Kazuhiko Oyama
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Law Office of Katsuhiro Arai
- Priority: JP2010-274072 20101208
- International Application: PCT/JP2011/073987 WO 20111019
- International Announcement: WO2012/077413 WO 20120614
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F5/00 ; H01F27/24 ; H01F7/06 ; H01F27/28 ; H01F17/00 ; H01F41/04

Abstract:
A group of magnetic sheets are stacked and connected via through-holes, on each of which magnetic sheets a circling pattern having connection parts at its corners and ends is formed to form a spiral coil pattern. Leader patterns each have a leader part formed at a position not overlapping with the circling parts of the coil pattern and connected to an external terminal electrode, as well as two connection parts that continue to the leader part and are formed at positions corresponding to the connection parts of the circling patterns, together with a cutout formed between the two connection parts. Magnetic sheets with the leader patterns are provided at the top and bottom of the laminate forming the coil pattern. The multilayer chip inductor can suppress decrease in core area caused by displacement due to the stacking.
Public/Granted literature
- US20140132385A1 MULTILAYER CHIP INDUCTOR AND PRODUCTION METHOD FOR SAME Public/Granted day:2014-05-15
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