Invention Grant
- Patent Title: Solid-state imaging apparatus and manufacturing method of solid-state imaging apparatus
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Application No.: US13807107Application Date: 2011-06-22
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Publication No.: US08947566B2Publication Date: 2015-02-03
- Inventor: Masahiro Kobayashi , Mineo Shimotsusa
- Applicant: Masahiro Kobayashi , Mineo Shimotsusa
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA, Inc. IP Division
- Priority: JP2010-149483 20100630; JP2011-105415 20110510
- International Application: PCT/JP2011/003566 WO 20110622
- International Announcement: WO2012/001915 WO 20120105
- Main IPC: H04N5/335
- IPC: H04N5/335 ; H04N3/14 ; H01L31/062 ; H01L31/0224 ; H01L27/146 ; H01L31/18
Abstract:
The first face of the pad is situated between the front-side face of the second semiconductor substrate and a hypothetical plane including and being parallel to the front-side face, and a second face of the pad that is a face on the opposite side of the first face is situated between the first face and the front-side face of the second semiconductor substrate, and wherein the second face is connected to the wiring structure so that the pad is electrically connected to the circuit arranged in the front-side face of the second semiconductor substrate via the wiring structure.
Public/Granted literature
- US20130105924A1 SOLID-STATE IMAGING APPARATUS AND MANUFACTURING METHOD OF SOLID-STATE IMAGING APPARATUS Public/Granted day:2013-05-02
Information query
