Invention Grant
- Patent Title: Magnetic head having a double bump wrap around shield
- Patent Title (中): 磁头具有围绕屏蔽的双凸起包裹
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Application No.: US14218761Application Date: 2014-03-18
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Publication No.: US08947828B1Publication Date: 2015-02-03
- Inventor: Wen-Chien D. Hsiao , Na Young Kim , Terence T. L. Lam , Yansheng Luo , Aron Pentek , Honglin Zhu
- Applicant: HGST Netherlands B.V.
- Applicant Address: NL Amsterdam
- Assignee: HGST Netherlands B.V.
- Current Assignee: HGST Netherlands B.V.
- Current Assignee Address: NL Amsterdam
- Agency: Zilke-Kotab, PC
- Main IPC: G11B5/127
- IPC: G11B5/127

Abstract:
In one embodiment, an apparatus includes a main pole, at least one side shield positioned on sides of the main pole, and a trailing shield having a multi-bump structure positioned near a trailing side of the main pole, wherein the multi-bump structure has six junctures along the trailing shield facing the main pole, a first juncture positioned at a media-facing surface, a sixth juncture positioned away from the media-facing surface, and second, third, fourth, and fifth junctures positioned along the side of the trailing shield facing the main pole between the first and sixth juncture, wherein an element height of a first face of the trailing shield positioned between the fourth and fifth juncture is less than an element height of a second face of the trailing shield positioned at an end of the trailing shield positioned opposite the media-facing surface of the trailing shield.
Public/Granted literature
- US3237459A Damping device Public/Granted day:1966-03-01
Information query
IPC分类: