Invention Grant
- Patent Title: Multilayer ceramic electronic component and manufacturing method thereof
- Patent Title (中): 多层陶瓷电子元件及其制造方法
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Application No.: US13538533Application Date: 2012-06-29
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Publication No.: US08947849B2Publication Date: 2015-02-03
- Inventor: Jin Woo Lee , Tae Hyeong Kim , Eung Soo Kim , Chi Hyoun Ro , Hang Kyu Cho
- Applicant: Jin Woo Lee , Tae Hyeong Kim , Eung Soo Kim , Chi Hyoun Ro , Hang Kyu Cho
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0040389 20120418
- Main IPC: H01G4/00
- IPC: H01G4/00

Abstract:
There is provided a multilayer ceramic electronic component. The multilayer ceramic electronic component includes a ceramic main body including a dielectric layer, and first and second internal electrodes disposed to face each other within the ceramic main body and having the dielectric layer interposed therebetween. When an average roughness of center lines of the first and second internal electrodes is Ra, a maximum distance from a virtual line corresponding to Ra to a bottom of a pit (d) formed below the virtual line is 0.1 μm to 13 μm. The surface roughness of the internal electrode printed surface is improved to decrease the occurrence of electrical shorts.
Public/Granted literature
- US20130279074A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-10-24
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