Invention Grant
- Patent Title: Supercapacitor and method for forming the same
- Patent Title (中): 超级电容器及其形成方法
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Application No.: US13455775Application Date: 2012-04-25
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Publication No.: US08947856B2Publication Date: 2015-02-03
- Inventor: Lian Wang , Tar Li Hsieh
- Applicant: Lian Wang , Tar Li Hsieh
- Applicant Address: TW Hsinchu
- Assignee: Ultracap Technologies Corp.
- Current Assignee: Ultracap Technologies Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Patterson Thuente Pedersen, P.A.
- Priority: TW100114761A 20110428
- Main IPC: H01G9/00
- IPC: H01G9/00 ; H01G5/38 ; H01G11/12 ; H01G11/72 ; H01G11/76 ; H01G11/28

Abstract:
A supercapacitor including at least one first electrode substrate having a surface coated with an active material, and at least one second electrode substrate having a surface coated with the active material, wherein the at least one first electrode substrate has a polarity reverse to that of the at least one second electrode substrate. The at least one first and second electrode substrates are stacked in an alternating arrangement. A plurality of the first electrode substrate having the same polarity or a plurality of the second electrode substrate having the same polarity is connected in parallel. The at least one first and second electrode substrates include stacking portions each having opposite surfaces arranged with a frame-shaped insulating ring. An electrolyte is accommodated in spaces enclosed by the opposite surfaces of each stacking portion of the at least one first and second electrode substrates and each insulating ring.
Public/Granted literature
- US20120275082A1 SUPERCAPACITOR AND METHOD FOR FORMING THE SAME Public/Granted day:2012-11-01
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