Invention Grant
- Patent Title: Electronic device protection
- Patent Title (中): 电子设备保护
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Application No.: US13303416Application Date: 2011-11-23
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Publication No.: US08947892B1Publication Date: 2015-02-03
- Inventor: Tai A. Lam
- Applicant: Tai A. Lam
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Toler Law Group, PC
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
Apparatus, systems and methods for electronic device protection are provided. A particular apparatus includes a non-conductive substrate and a plurality of cells including conductive members coupled to the non-conductive substrate. The conductive members are arranged to form a first discontinuous mesh. Regions between the conductive members of the first discontinuous mesh include a phase change material. The phase change material undergoes a phase transition from substantially non-conductive to substantially conductive responsive to a change of energy.
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