Invention Grant
- Patent Title: Semiconductor memory chip and multi-chip package using the same
- Patent Title (中): 半导体存储芯片和多芯片封装使用相同
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Application No.: US13244189Application Date: 2011-09-23
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Publication No.: US08947942B2Publication Date: 2015-02-03
- Inventor: Bok Rim Ko , Kwang Soon Kim
- Applicant: Bok Rim Ko , Kwang Soon Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Patent Ltd.
- Priority: KR10-2011-0008321 20110127
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G11C7/10
Abstract:
A semiconductor memory chip includes a first pad unit configured to receive a first data and a first strobe signal, and a first selection transfer unit configured to transfer the first data and the first strobe signal to a first write path circuit in a first mode, and transfer the first data and the first strobe signal to a second write path circuit in a swap mode.
Public/Granted literature
- US20120195089A1 SEMICONDUCTOR MEMORY CHIP AND MULTI-CHIP PACKAGE USING THE SAME Public/Granted day:2012-08-02
Information query
