Invention Grant
- Patent Title: Component mounting apparatus
- Patent Title (中): 组件安装设备
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Application No.: US13357407Application Date: 2012-01-24
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Publication No.: US08948900B2Publication Date: 2015-02-03
- Inventor: Yasushi Miyake
- Applicant: Yasushi Miyake
- Applicant Address: JP Shizuoka-ken
- Assignee: Yamaha Hatsudoki Kabushiki Kaisha
- Current Assignee: Yamaha Hatsudoki Kabushiki Kaisha
- Current Assignee Address: JP Shizuoka-ken
- Agency: Studebaker & Brackett PC
- Priority: JP2011-037991 20110224
- Main IPC: G06F19/00
- IPC: G06F19/00 ; H05K13/08 ; H05K13/04

Abstract:
A component mounting apparatus includes: an operational sequence supervision unit which is created in compiler language determining an operational sequence specifying a series of sequence operations of suctioning, recognizing and mounting a component; and a second memory unit which stores a custom program, created in interpreter language and specifying an operation different from the series of sequence operations, and custom program designation information that designates execution of the custom program. The operational sequence supervision unit controls a switching process for switching from the series of sequence operations to an interpreter language processing execution routine for executing the custom program, during, or before or after, the series of sequence operations in accordance with the custom program designation information.
Public/Granted literature
- US20130025118A1 COMPONENT MOUNTING APPARATUS Public/Granted day:2013-01-31
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