Invention Grant
- Patent Title: Computer-based modeling of integrated circuit congestion and wire distribution for products and services
- Patent Title (中): 基于计算机的产品和服务集成电路拥塞和电线分配建模
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Application No.: US14059801Application Date: 2013-10-22
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Publication No.: US08949762B1Publication Date: 2015-02-03
- Inventor: Charles J. Alpert , Zhuo Li , Chin Ngai Sze , Jia Wang , Yaoguang Wei
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent William Stock
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A computer-based system and method for modeling integrated circuit congestion and wire distribution determines a boundary where a tile congestion corresponding to a first layer group is equivalent to a first blockage ratio corresponding to a second layer group, formulates a piece-wise linear formula that relates the tile congestion to a number of wires of a two-dimensional tile, and distributes a portion of the number of wires to a layer of the tile based on the tile congestion.
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