Invention Grant
- Patent Title: Parallel-plate structure fabrication method
- Patent Title (中): 平行板结构制造方法
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Application No.: US12440743Application Date: 2007-09-14
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Publication No.: US08950057B2Publication Date: 2015-02-10
- Inventor: Tommi Riekkinen , Tomi Mattila
- Applicant: Tommi Riekkinen , Tomi Mattila
- Applicant Address: FI
- Assignee: Valtion Teknillinen Tutkimuskeskus
- Current Assignee: Valtion Teknillinen Tutkimuskeskus
- Current Assignee Address: FI
- Agency: Thorpe North & Western LLP
- Priority: FI20060832 20060918
- International Application: PCT/FI2007/000232 WO 20070914
- International Announcement: WO2008/034940 WO 20080327
- Main IPC: H01S4/00
- IPC: H01S4/00 ; H01G7/00 ; H01G7/06 ; H01L49/02 ; H01L41/29 ; H01L41/187 ; H01L41/312

Abstract:
A fabrication method for parallel-plate structures and a parallel-plate structure arrangement, wherein the structures have a middle layer, grown on a substrate and disposed between top and bottom electrode layers, wherein the middle layer and the top and bottom electrode layers are deposited on a bottom substrate, and wherein the middle layer is grown first and the top and bottom electrodes are essentially deposited afterwards.
Public/Granted literature
- US20100067167A1 PARALLEL-PLATE STRUCTURE FABRICATION METHOD AND PARALLEL-PLATE STRUCTURE ARRANGEMENT Public/Granted day:2010-03-18
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