Invention Grant
- Patent Title: Dimensional tile backing
- Patent Title (中): 尺寸瓦背衬
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Application No.: US14133164Application Date: 2013-12-18
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Publication No.: US08950140B1Publication Date: 2015-02-10
- Inventor: Rodney James Katwyk
- Applicant: Dimensional Tile Backer, LLC
- Applicant Address: US UT Park City
- Assignee: Dimensional Tile Backer, LLC
- Current Assignee: Dimensional Tile Backer, LLC
- Current Assignee Address: US UT Park City
- Agency: Kunzler Law Group
- Main IPC: E04F13/08
- IPC: E04F13/08

Abstract:
A system for mounting tile relative to a flat surface may include a plurality of tiles and support structure to be mounted to the flat surface. The support structure may have a plurality of support surfaces on which the tiles are mounted such that the tiles are at different angles and/or heights relative to the flat surface. The support surfaces may be arranged in a wide variety of patterns, and may have shapes that correspond to those of the tiles. The tiles and support surfaces may have a wide variety of shapes. The support structure may be a single piece on which all of the support surfaces are formed, or may be created through the assembly of multiple support blocks, each of which has one or more of the support surfaces thereon.
Public/Granted literature
- US20150040501A1 DIMENSIONAL TILE BACKING Public/Granted day:2015-02-12
Information query
IPC分类: