Invention Grant
- Patent Title: Element structure, inertia sensor, and electronic device
- Patent Title (中): 元件结构,惯性传感器和电子设备
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Application No.: US13115580Application Date: 2011-05-25
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Publication No.: US08950259B2Publication Date: 2015-02-10
- Inventor: Shigekazu Takagi
- Applicant: Shigekazu Takagi
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2010-120725 20100526
- Main IPC: G01P15/125
- IPC: G01P15/125 ; G01P15/18 ; G01C19/5783 ; G01P15/08

Abstract:
The manufacturing of an element structure including two or more sensor element is to be facilitated. An element structure includes a first substrate including a first support layer and a first sensor element disposed on the first support layer and a second substrate including a second support layer and a second sensor element disposed on the second support layer, wherein the second substrate is disposed on the first substrate via a spacer member in a state in which the first sensor element and the second sensor element are disposed to face each other.
Public/Granted literature
- US20110290023A1 ELEMENT STRUCTURE, INERTIA SENSOR, AND ELECTRONIC DEVICE Public/Granted day:2011-12-01
Information query
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