Invention Grant
- Patent Title: Spoiler for vehicle
- Patent Title (中): 汽车扰流板
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Application No.: US13823094Application Date: 2011-08-30
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Publication No.: US08950798B2Publication Date: 2015-02-10
- Inventor: Hiroyuki Inubushi
- Applicant: Hiroyuki Inubushi
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2010-213628 20100924
- International Application: PCT/JP2011/069552 WO 20110830
- International Announcement: WO2012/039242 WO 20120329
- Main IPC: B62D35/00
- IPC: B62D35/00 ; B60Q1/44

Abstract:
A vehicle spoiler that is provided to the rear part of the vehicle body and extends in the width direction of the vehicle. The spoiler is provided with a resin external surface member; and a metallic reinforcement member for reinforcing the external surface member. The reinforcement member is provided with a reinforcement body extending rearward with respect to the vehicle body from the rear part thereof. The external surface member has an upper member that extends in the width direction of the vehicle above the reinforcement body, and also has a lower member that extends in the width direction of the vehicle below the reinforcement body. The reinforcement body is inserted through the inside of the hollow closed cross-section formed by the upper member and the lower member. The upper member and the lower member are joined within the hollow closed cross-section to the reinforcement body.
Public/Granted literature
- US20130223091A1 SPOILER FOR VEHICLE Public/Granted day:2013-08-29
Information query
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