Invention Grant
- Patent Title: Wafer-level underfill and over-molding
- Patent Title (中): 晶圆级底部填充和超模塑
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Application No.: US13411293Application Date: 2012-03-02
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Publication No.: US08951037B2Publication Date: 2015-02-10
- Inventor: Bor-Ping Jang , Yeong-Jyh Lin , Chien Ling Hwang , Chung-Shi Liu
- Applicant: Bor-Ping Jang , Yeong-Jyh Lin , Chien Ling Hwang , Chung-Shi Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: B29C45/22
- IPC: B29C45/22
Abstract:
A mold includes a top portion, and an edge ring having a ring-shape. The edge ring is underlying and connected to edges of the top portion. The edge ring includes air vents. The edge ring further encircles the inner space under the top portion of the mold. A plurality of injection ports is connected to the inner space of the mold. The plurality of injection ports is substantially aligned to a straight line crossing a center of the top portion of the mold. The plurality of injection ports has different sizes.
Public/Granted literature
- US20130228951A1 Wafer-Level Underfill and Over-Molding Public/Granted day:2013-09-05
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