Invention Grant
- Patent Title: Crimp terminal
- Patent Title (中): 压接端子
-
Application No.: US13873652Application Date: 2013-04-30
-
Publication No.: US08951063B2Publication Date: 2015-02-10
- Inventor: Kiyokazu Iio
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JP2012-111445 20120515
- Main IPC: H01R13/52
- IPC: H01R13/52 ; H01R4/18 ; H01R4/72 ; H01R4/70

Abstract:
A crimp terminal (10) has a connecting portion (12) that is conductively connected to an electrical connection target, a crimp portion (14) that has a core crimping portion (22) that is fixed by crimping to a core (38) of a coated wire (32), and a link (16) that extends between the connecting portion (12) and the crimp portion (14), a positioning protrusion (30) is formed by a pair of slits (26) penetrating through the link (16) and extending in a direction along which the link (16) so as to be separated from each other in a width direction orthogonal to the extension direction. An intermediate region (28) sandwiched between the slits (26) in the width direction is deformed to protrude on a side on which the core crimping portion (22) protrudes.
Public/Granted literature
- US20130309903A1 CRIMP TERMINAL Public/Granted day:2013-11-21
Information query