Invention Grant
US08951354B2 Megasonic cleaning with controlled boundary layer thickness and associated systems and methods
有权
具有受控边界层厚度和相关系统和方法的超声波清洗
- Patent Title: Megasonic cleaning with controlled boundary layer thickness and associated systems and methods
- Patent Title (中): 具有受控边界层厚度和相关系统和方法的超声波清洗
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Application No.: US13430376Application Date: 2012-03-26
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Publication No.: US08951354B2Publication Date: 2015-02-10
- Inventor: Nishant Sinha
- Applicant: Nishant Sinha
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: B08B3/12
- IPC: B08B3/12 ; H01L21/67
Abstract:
Megasonic cleaning systems and methods of using megasonic pressure waves to impart cavitation energy proximate a surface of a microelectronic substrate are disclosed herein. In one embodiment, a megasonic cleaning system includes a process tank for containing a liquid, a support element for carrying a substrate submerged in the liquid, and first and second transducers positioned in the tank. The first transducer is further positioned and/or operated to initiate cavitation events in a bulk portion of the liquid proximate a surface of the substrate. The second transducer is further positioned and/or operated to control an interface of fluid friction between the substrate and the bulk portion of the liquid.
Public/Granted literature
- US20120174943A1 MEGASONIC CLEANING WITH CONTROLLED BOUNDARY LAYER THICKNESS AND ASSOCIATED SYSTEMS AND METHODS Public/Granted day:2012-07-12
Information query
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