Invention Grant
- Patent Title: Aluminum alloy wire material
- Patent Title (中): 铝合金线材
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Application No.: US13184901Application Date: 2011-07-18
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Publication No.: US08951370B2Publication Date: 2015-02-10
- Inventor: Shigeki Sekiya , Kuniteru Mihara , Kyota Susai
- Applicant: Shigeki Sekiya , Kuniteru Mihara , Kyota Susai
- Applicant Address: JP Tokyo
- Assignee: Furukawa Electric Co., Ltd.
- Current Assignee: Furukawa Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP.
- Priority: JP2009-009370 20090119
- Main IPC: C22C21/00
- IPC: C22C21/00 ; H01B1/02

Abstract:
An aluminum alloy wire material, which has an alloy composition containing: 0.1 to 0.4 mass % of Fe, 0.1 to 0.3 mass % of Cu, 0.02 to 0.2 mass % of Mg, and 0.02 to 0.2 mass % of Si, and further containing 0.001 to 0.01 mass % of Ti and V in total, with the balance being Al and unavoidable impurities, in which a grain size is 5 to 25 μm in a vertical cross-section in a wire-drawing direction of the wire material, in which, according to JIS Z 2241, a tensile strength (TS) is 80 MPa or more, an elongation (El) is 15% or more, and a 0.2% yield strength (YS; MPa) satisfies, together with the TS, a relationship represented by formula: 1.5≦(TS/YS)≦3, and in which an electrical conductivity is 55% IACS or more.
Public/Granted literature
- US20110272175A1 ALUMINUM ALLOY WIRE MATERIAL Public/Granted day:2011-11-10
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