Invention Grant
- Patent Title: Cylindrical magnetron having a shunt
- Patent Title (中): 具有分流的圆柱磁控管
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Application No.: US12887065Application Date: 2010-09-21
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Publication No.: US08951394B2Publication Date: 2015-02-10
- Inventor: Mark A. Bernick , Richard Newcomb
- Applicant: Mark A. Bernick , Richard Newcomb
- Applicant Address: US PA Duquesne
- Assignee: Angstrom Sciences, Inc.
- Current Assignee: Angstrom Sciences, Inc.
- Current Assignee Address: US PA Duquesne
- Agency: The Webb Law Firm
- Main IPC: C23C14/00
- IPC: C23C14/00 ; C25B11/00 ; C25B13/00 ; C23C14/35 ; C23C14/54

Abstract:
A magnetron sputtering electrode for use in a rotatable cylindrical magnetron sputtering device, the electrode including a cathode body defining a magnet receiving chamber and a cylindrical target surrounding the cathode body. The target is rotatable about the cathode body A magnet arrangement is received within the magnet receiving chamber, the magnet arrangement including a plurality of magnets. A shunt is secured to the cathode body and proximate to a side of the magnet arrangement, the shunt extending in a plane substantially parallel to the side of the magnet arrangement. A method of fine-tuning a magnetron sputtering electrode in a rotatable cylindrical magnetron sputtering device is also disclosed.
Public/Granted literature
- US20110186427A1 Cylindrical Magnetron Having a Shunt Public/Granted day:2011-08-04
Information query
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