Invention Grant
US08951426B2 Method of fabricating an implantable medical device that includes one or more thin film polymer support layers
有权
一种制造包括一个或多个薄膜聚合物支撑层的可植入医疗装置的方法
- Patent Title: Method of fabricating an implantable medical device that includes one or more thin film polymer support layers
- Patent Title (中): 一种制造包括一个或多个薄膜聚合物支撑层的可植入医疗装置的方法
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Application No.: US14080259Application Date: 2013-11-14
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Publication No.: US08951426B2Publication Date: 2015-02-10
- Inventor: Robert Brindley , John Janik , Edward Chia-Ning Tang
- Applicant: Stryker Corporation
- Applicant Address: US MI Kalamazoo
- Assignee: Stryker Corporation
- Current Assignee: Stryker Corporation
- Current Assignee Address: US MI Kalamazoo
- Main IPC: B44C1/22
- IPC: B44C1/22
Abstract:
An implantable medical device formed from one or more layers of thin film polymer is assembled by providing by adhesively securely one or more polymer coupons on individual rigid backings. After each coupon is shaped or components mounted to the coupon, the coupons are bonded together. The adhesive is dissolved to remove the device from the backing or backings to which it is attached.
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