Invention Grant
- Patent Title: Connector producing method and molding die
- Patent Title (中): 连接器制造方法和成型模具
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Application No.: US12844866Application Date: 2010-07-28
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Publication No.: US08951459B2Publication Date: 2015-02-10
- Inventor: Shinyu Nagashima
- Applicant: Shinyu Nagashima
- Applicant Address: JP Yokkaichi
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Yokkaichi
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JP2009-185881 20090810; JP2009-190170 20090819
- Main IPC: B29C45/14
- IPC: B29C45/14 ; H01R13/504 ; H01R43/24 ; B29C45/00
Abstract:
A method is provided for producing a connector so that a terminal fitting is unlikely to move. A terminal fitting (20) is set in a molding die assembly that has a first die (60) and a second die (70). Resin then is injected to mold housing (40) including the terminal fitting (20) as an insert. A potting material (49) then is injected into a recess (45) in the housing (40) to produce a male connector. The first die (60) has a tab insertion hole (62) for fixing the terminal fitting (20), and the second die (70) has a gate (72) for injecting the resin. A cavity (81) is formed by placing the second die (70) on the first die (60) so that a projection (26) on the terminal fitting 20 is sandwiched between fitting pressing portions on the dies (60, 70).
Public/Granted literature
- US20110034089A1 CONNECTOR PRODUCING METHOD AND MOLDING DIE Public/Granted day:2011-02-10
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