Invention Grant
- Patent Title: Heat dissipating tape using conductive fiber and method for manufacturing same
- Patent Title (中): 使用导电纤维的散热带及其制造方法
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Application No.: US14064746Application Date: 2013-10-28
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Publication No.: US08951629B2Publication Date: 2015-02-10
- Inventor: Eui Hong Min
- Applicant: Solueta
- Applicant Address: KR Ansan, Gyeonggi-Do
- Assignee: Solueta
- Current Assignee: Solueta
- Current Assignee Address: KR Ansan, Gyeonggi-Do
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Priority: KR10-2011-0040331 20110428; KR10-2012-0044490 20120427
- Main IPC: G11B5/708
- IPC: G11B5/708 ; G11B5/735 ; G11B5/738 ; B32B7/12 ; B32B27/08 ; H05K7/20 ; H05K9/00 ; C09J7/02 ; C09J7/04 ; C08K3/04

Abstract:
The present invention relates to a heat dissipating tape using a conductive fiber and a method for manufacturing same. More particularly, the present invention provides a heat dissipating tape, comprising: a conductive substrate which is made of conductive fiber coated with a conductive material; and an heat dissipating adhesion layer which is formed on at least one side of the conductive substrate and is coated with a heat dissipating adhesive including a graphite-containing acrylic adhesive or silicon adhesive. The heat dissipating tape has excellent resistance to external forces on the product, has an excellent outer appearance due to its smooth surface, is less likely to get damaged, and the heat dissipating adhesion layer is not easily separated from the conductive substrate.
Public/Granted literature
- US20140050915A1 HEAT DISSIPATING TAPE USING CONDUCTIVE FIBER AND METHOD FOR MANUFACTURING SAME Public/Granted day:2014-02-20
Information query
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