Invention Grant
- Patent Title: Light emitting device chip scale package
- Patent Title (中): 发光器件芯片级封装
-
Application No.: US13997673Application Date: 2011-12-29
-
Publication No.: US08951817B2Publication Date: 2015-02-10
- Inventor: Daniel Alexander Steigerwald
- Applicant: Daniel Alexander Steigerwald
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips N.V.
- Current Assignee: Koninklijke Philips N.V.
- Current Assignee Address: NL Eindhoven
- International Application: PCT/IB2011/056010 WO 20111229
- International Announcement: WO2012/101489 WO 20120802
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/08 ; H01L33/62 ; H01L33/50 ; H01L33/00 ; H01L23/00 ; H01L21/683

Abstract:
The substrate that is used to support the growth of the LED structure is used to support the creation of a superstructure above the LED structure. The superstructure is preferably created as a series of layers, including conductive elements that forma conductive path from the LED structure to the top of the superstructure, as well as providing structural support to the light emitting device. The structure is subsequently inverted, such that the superstructure becomes the carrier substrate for the LED structure, and the original substrate is thinned or removed. The structure is created using materials that facilitate electrical conduction and insulation, as well as thermal conduction and dissipation.
Public/Granted literature
- US20130292716A1 LIGHT EMITTING DEVICE CHIP SCALE PACKAGE Public/Granted day:2013-11-07
Information query
IPC分类: