Invention Grant
US08951838B2 Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation
有权
低成本和超薄芯片在晶圆上的基板（CoWoS）形成
- Patent Title: Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation
- Patent Title (中): 低成本和超薄芯片在晶圆上的基板（CoWoS）形成
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Application No.: US13830570Application Date: 2013-03-14
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Publication No.: US08951838B2Publication Date: 2015-02-10
- Inventor: Hsin-Yu Chen , Lin-Chih Huang , Tasi-Jung Wu , Tsang-Jiuh Wu , Wen-Chih Chiou
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/00
Abstract:
Methods of making and an integrated circuit device. An embodiment method includes patterning a first polymer layer disposed over a first copper seed layer, electroplating a through polymer via in the first polymer layer using the first copper seed layer, a via end surface offset from a first polymer layer surface, forming a second polymer layer over the first polymer layer, the second polymer layer patterned to expose the via end surface, and electroplating an interconnect in the second polymer layer to cap the via end surface using a second copper seed layer.
Public/Granted literature
- US20140264834A1 Low Cost and Ultra-Thin Chip on Wafer on Substrate (CoWoS) Formation Public/Granted day:2014-09-18
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