Invention Grant
- Patent Title: Controlling thermal interface material bleed out
- Patent Title (中): 控制热界面材料渗出
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Application No.: US13991900Application Date: 2012-05-31
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Publication No.: US08951846B2Publication Date: 2015-02-10
- Inventor: Gopi Krishnan , Mingjie Xu , Edvin Cetegen , Sung-Won Moon
- Applicant: Gopi Krishnan , Mingjie Xu , Edvin Cetegen , Sung-Won Moon
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- International Application: PCT/US2012/040316 WO 20120531
- International Announcement: WO2013/180726 WO 20131205
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L23/34 ; H01L23/373 ; H01L23/42
Abstract:
An extended preform of a thermal interface material (TIM) is formed between a heat spreader and a die on a substrate. The preform has an extension beyond a footprint of the die. The preform is cured. A bleed out of the TIM is controlled by the extension upon curing of the preform.
Public/Granted literature
- US20140027899A1 CONTROLLING THERMAL INTERFACE MATERIAL BLEED OUT Public/Granted day:2014-01-30
Information query
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