Invention Grant
- Patent Title: Method for separating a layer system comprising a wafer by precisely maintaining the position of the separating front
- Patent Title (中): 通过精确地保持分离前沿的位置来分离包括晶片的层系统的方法
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Application No.: US13141470Application Date: 2009-12-23
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Publication No.: US08951886B2Publication Date: 2015-02-10
- Inventor: Franz Richter
- Applicant: Franz Richter
- Applicant Address: DE Eichenau
- Assignee: Thin Materials AG
- Current Assignee: Thin Materials AG
- Current Assignee Address: DE Eichenau
- Agency: Duane Morris LLP
- Agent J. Rodman Steele, Jr.; Gregory M. Lefkowitz
- Priority: DE102008055155 20081223; EP09151661 20090129
- International Application: PCT/EP2009/067893 WO 20091223
- International Announcement: WO2010/072826 WO 20100701
- Main IPC: H01L21/46
- IPC: H01L21/46 ; H01L21/322 ; H01L21/683
Abstract:
A method for mechanically separating a laminar structure from a first carrier assembly, comprising or consisting of a first carrier, wherein the laminar structure comprises a wafer and a second, stretchable carrier is disclosed. Also disclosed are the use of a particular separating aid for separating a laminar structure and a device for carrying out the method.
Public/Granted literature
- US20120028438A1 METHOD FOR SEPARATING A LAYER SYSTEM COMPRISING A WAFER Public/Granted day:2012-02-02
Information query
IPC分类:
