Invention Grant
- Patent Title: Deposition substrate of deposition apparatus, method of forming layer using the same, and method of manufacturing organic light emitting diode display device
- Patent Title (中): 沉积装置的沉积基板,使用其形成层的方法以及制造有机发光二极管显示装置的方法
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Application No.: US13988875Application Date: 2010-07-07
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Publication No.: US08951891B2Publication Date: 2015-02-10
- Inventor: Jae-Sang Ro , Won-Eui Hong
- Applicant: Jae-Sang Ro , Won-Eui Hong
- Applicant Address: KR
- Assignee: Ensil Tech Corporation
- Current Assignee: Ensil Tech Corporation
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2009-0063135 20090710
- International Application: PCT/KR2010/004411 WO 20100707
- International Announcement: WO2011/005021 WO 20110113
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L51/56 ; H01L51/00 ; C23C14/04 ; C23C14/26 ; B32B3/26 ; B32B3/30 ; H01L51/50

Abstract:
Provided are a deposition substrate of a deposition apparatus, a method of forming a layer using the same, and a method of manufacturing an organic light emitting diode (OLED) display device. The method of forming a layer using the deposition substrate includes preparing a substrate, forming a heating conductive layer for Joule heating on the substrate, forming a first insulating layer on the heating conductive layer for Joule heating and including a groove or hole, forming a deposition material layer on a top surface of the first insulating layer having the groove or hole, and applying an electric field to the heating conductive layer for Joule heating to perform Joule-heating on the deposition material layer. Thus, the method is suitable for manufacturing a large-sized device.
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