Invention Grant
- Patent Title: Copper-catalyzed C—H bond arylation
- Patent Title (中): 铜催化的C-H键芳基化
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Application No.: US12208286Application Date: 2008-09-10
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Publication No.: US08952207B2Publication Date: 2015-02-10
- Inventor: Olafs Daugulis , Hien-Quang Do
- Applicant: Olafs Daugulis , Hien-Quang Do
- Applicant Address: US TX Houston
- Assignee: The University of Houston System
- Current Assignee: The University of Houston System
- Current Assignee Address: US TX Houston
- Agent Robert W Strozier
- Main IPC: C07C22/00
- IPC: C07C22/00 ; C07C25/13 ; C07F9/02 ; C07D333/00 ; C07D409/02 ; C07B37/04 ; C07C17/269 ; C07C41/30 ; C07C45/68 ; C07C253/30 ; C07D213/06 ; C07D213/89 ; C07D215/04 ; C07D237/08 ; C07D239/26 ; C07D239/74 ; C07D249/08 ; C07D263/32 ; C07D263/57 ; C07D277/22 ; C07D277/66 ; C07D307/79 ; C07D333/06 ; C07D333/12 ; C07D333/54 ; C07D413/04 ; C07D471/04

Abstract:
The present invention is a one-step method for efficiently converting carbon-hydrogen bonds into carbon-carbon bonds using a combination of aryl halides, a substrate, and a copper salt as catalyst. This method allows faster introduction of complex molecular entities, a process that would otherwise require many more steps. This invention is particularly relevant for the organic synthesis of complex molecules such as, but not limited to, pharmacophores and explosives.
Public/Granted literature
- US20090076266A1 COPPER-CATALYZED C-H BOND ARYLATION Public/Granted day:2009-03-19
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