Invention Grant
- Patent Title: Connection structure and connection method for suprressing radiation of common noise in a superimposed wiring member
- Patent Title (中): 用于叠加配线构件中普通噪声的抵抗辐射的连接结构和连接方法
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Application No.: US13530502Application Date: 2012-06-22
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Publication No.: US08952250B2Publication Date: 2015-02-10
- Inventor: Katsuhiko Hayashi
- Applicant: Katsuhiko Hayashi
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Maschoff Brennan
- Priority: JP2011-138239 20110622; JP2011-183379 20110825
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/02 ; H05K1/14
Abstract:
When a GND electrode of a main board is connected to a GND electrode of a daughter board by a flat cable, an end portion of one side of a first GND line is connected to the GND electrode of the main board and an end portion of the other side of the first GND line is connected to the GND electrode of the daughter board. An end portion of one side of a second GND line is insulated from a circuit of the main board and an end portion of the other side of the second GND line is connected to the GND electrode of the daughter board.
Public/Granted literature
- US20120325550A1 CONNECTION STRUCTURE AND CONNECTION METHOD Public/Granted day:2012-12-27
Information query
