Invention Grant
- Patent Title: Enclosure of electronic device
- Patent Title (中): 电子设备外壳
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Application No.: US13686934Application Date: 2012-11-28
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Publication No.: US08952253B2Publication Date: 2015-02-10
- Inventor: Wei Huang , Lei Li
- Applicant: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd. , Hon Hai Precision Industry Co., Ltd.
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove & Quigg LLP
- Priority: CN201210477125 20121122
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H01R13/6596 ; H01R13/6583

Abstract:
An enclosure includes a sidewall defining an opening through which a connector is to extend and a through hole, a resilient piece, and a sliding member slidably received in the through hole. The resilient piece includes a connecting piece slantingly extending from the sidewall between the opening and the through hole and a contacting piece connected to a distal end of the connecting piece. When the connector extends through the opening, The sliding member is slid toward the resilient piece to force the contacting piece to contact the connector.
Public/Granted literature
- US20140140014A1 ENCLOSURE OF ELECTRONIC DEVICE Public/Granted day:2014-05-22
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