The present invention enables additional processes required for forming vertical wiring and rewiring in a double face package (DFP) or a wafer level chip size package (WLCSP) to be implemented through use of a component for vertical wiring and rewiring, to thereby simplify the manufacturing process and reduce cost. An electronic component for interconnection is incorporated into an electronic device package in which a circuit element including a semiconductor chip is disposed and which has external electrodes connected to the circuit element via vertical interconnects and horizontal interconnects. This electronic component for interconnection is composed of a wiring substrate which includes horizontal interconnects and vertical interconnects connected to the horizontal interconnects and extending therefrom in a vertical direction; and a support plate to which the wiring substrate having the horizontal interconnects and the vertical interconnects is bonded through use of an adhesive which can be separated with water.