Invention Grant
- Patent Title: Structural body and interconnect substrate
- Patent Title (中): 结构体和互连基板
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Application No.: US13813632Application Date: 2011-08-26
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Publication No.: US08952266B2Publication Date: 2015-02-10
- Inventor: Hiroshi Toyao
- Applicant: Hiroshi Toyao
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2010-217237 20100928
- International Application: PCT/JP2011/004766 WO 20110826
- International Announcement: WO2012/042740 WO 20120405
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/03 ; H05K1/09 ; H04B3/28 ; H01P3/08 ; H05K1/14 ; H05K1/02 ; H01P1/20 ; H01Q15/00 ; H05K1/16

Abstract:
A structural body includes: a first conductor and a second conductor of which at least portions are opposite to each other; a third conductor, interposed between the first conductor and the second conductor, of which at least a portion is opposite to the first conductor and the second conductor, and has a first opening; an interconnect provided in the inside of the first opening; and a conductor via which is electrically connected to the first conductor and the second conductor and is electrically insulated from the third conductor, wherein the interconnect is opposite to the first conductor and the second conductor, one end thereof being electrically connected to the third conductor at an edge of the first opening and an other end thereof being formed as an open end.
Public/Granted literature
- US20130126225A1 STRUCTURAL BODY AND INTERCONNECT SUBSTRATE Public/Granted day:2013-05-23
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