Invention Grant
- Patent Title: Wiring substrate, multi-piece wiring substrate array, and manufacturing method therefor
- Patent Title (中): 布线基板,多片布线基板阵列及其制造方法
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Application No.: US14111486Application Date: 2012-02-01
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Publication No.: US08952269B2Publication Date: 2015-02-10
- Inventor: Masami Hasegawa , Satoshi Hirayama , Naoki Kito
- Applicant: Masami Hasegawa , Satoshi Hirayama , Naoki Kito
- Applicant Address: JP Nagoya
- Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Stites & Harbison PLLC
- Agent Jeffrey A. Haeberlin
- Priority: JP2011-112398 20110519
- International Application: PCT/JP2012/000668 WO 20120201
- International Announcement: WO2012/157152 WO 20121122
- Main IPC: H05K1/11
- IPC: H05K1/11 ; B32B3/00 ; H05K1/03 ; H05K3/00 ; H05K3/38 ; H05K3/40

Abstract:
Provided are a wiring substrate; a multi-piece wiring substrate array; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate includes a substrate main body, which has first and second main surfaces, side surfaces, a groove surface, and a fracture surface; and a notch which has a concave shape in plan view, and which is provided on a side surface on a side toward the first main surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has first curved portions on opposite sides of the notch, the first curved portions being convex toward the first main surface in side view; and also has a second curved portion on a second-main-surface side of the notch, the second curved portion being convex toward the second main surface of the substrate main body in side view.
Public/Granted literature
- US20140037912A1 WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE ARRAY, AND MANUFACTURING METHOD THEREFOR Public/Granted day:2014-02-06
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