Invention Grant
- Patent Title: Circuit board, semiconductor device, and method of manufacturing semiconductor device
- Patent Title (中): 电路板，半导体器件及半导体器件的制造方法
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Application No.: US14106041Application Date: 2013-12-13
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Publication No.: US08952271B2Publication Date: 2015-02-10
- Inventor: Masaharu Furuyama , Daisuke Mizutani , Seiki Sakuyama , Toshiya Akamatsu
- Applicant: Fujitsu Limited
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2007-262334 20071005
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; H05K7/00 ; H05K5/00 ; H05K7/04 ; H05K3/10 ; H01L23/498 ; H05K3/24 ; H05K3/34
Abstract:
There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode.
Public/Granted literature
- US20140103097A1 CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2014-04-17
Information query
