Invention Grant
- Patent Title: Electronic device and method of manufacturing the same, and semiconductor device and method of manufacturing the same
- Patent Title (中): 电子器件及其制造方法以及半导体器件及其制造方法
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Application No.: US13212605Application Date: 2011-08-18
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Publication No.: US08952359B2Publication Date: 2015-02-10
- Inventor: Toshio Fukuda , Noriyuki Kawashima
- Applicant: Toshio Fukuda , Noriyuki Kawashima
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2010-188103 20100825
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L35/24 ; H01L51/00 ; H01L51/05 ; H01L51/10
Abstract:
Disclosed herein is an electronic device, including: (A) a control electrode; (B) a first electrode and a second electrode; and (C) an active layer composed of an organic semiconductor material layer provided between the first electrode and the second electrode so as to face the control electrode through an insulating layer, wherein a portion of the insulating layer contacting at least the active layer is composed of a layer obtained by curing a material expressed by the general structural formula (1), (2) or (3):
Public/Granted literature
Information query
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