Invention Grant
- Patent Title: Silicon carbide semiconductor device and its manufacturing method
- Patent Title (中): 碳化硅半导体器件及其制造方法
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Application No.: US10531582Application Date: 2003-10-03
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Publication No.: US08952391B2Publication Date: 2015-02-10
- Inventor: Shinsuke Harada , Tsutomu Yatsuo , Kenji Fukuda , Mitsuo Okamoto , Kazuhiro Adachi , Seiji Suzuki
- Applicant: Shinsuke Harada , Tsutomu Yatsuo , Kenji Fukuda , Mitsuo Okamoto , Kazuhiro Adachi , Seiji Suzuki
- Applicant Address: JP Tokyo JP Moriguchi-shi
- Assignee: National Institute of Advanced Industrial Science and Technology,Sanyo Electric Co., Ltd.
- Current Assignee: National Institute of Advanced Industrial Science and Technology,Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Tokyo JP Moriguchi-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2002-304596 20021018
- International Application: PCT/JP03/12727 WO 20031003
- International Announcement: WO2004/036655 WO 20040429
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/66 ; H01L21/04 ; H01L29/78 ; H01L21/02 ; H01L29/10 ; H01L29/16 ; H01L29/423

Abstract:
A silicon carbide vertical MOSFET having low ON-resistance and high blocking voltage. A first deposition film of low concentration silicon carbide of a first conductivity type is formed on the surface of a high concentration silicon carbide substrate of a first conductivity type. Formed on the first deposition film is a second deposition film that includes a high concentration gate region of a second conductivity type, with a first region removed selectively. A third deposition film is formed on the second deposition film, which includes a second region that is wider than the selectively removed first region, a high concentration source region of a first conductivity type, and a low concentration gate region of a second conductivity type. A low concentration base region of a first conductivity type is formed in contact with the first deposition film in the first and second regions.
Public/Granted literature
- US20060057796A1 Silicon carbide semiconductor device and its method of manufacturing method Public/Granted day:2006-03-16
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