Invention Grant
US08952396B2 LED module, backlight unit including the LED module, and method for manufacturing the LED module
有权
LED模块，包括LED模块的背光单元以及用于制造LED模块的方法
- Patent Title: LED module, backlight unit including the LED module, and method for manufacturing the LED module
- Patent Title (中): LED模块，包括LED模块的背光单元以及用于制造LED模块的方法
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Application No.: US13475323Application Date: 2012-05-18
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Publication No.: US08952396B2Publication Date: 2015-02-10
- Inventor: Jee Hoon Sung , Jin Hyun Cho , Jung Kyun Kim
- Applicant: Jee Hoon Sung , Jin Hyun Cho , Jung Kyun Kim
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2011-0046759 20110518
- Main IPC: G09F13/18
- IPC: G09F13/18 ; H01L33/48 ; H01L33/64 ; H05K1/02 ; H01L33/62 ; H05K1/05
Abstract:
A light emitting diode (LED) module having a structure capable of effectively dissipating heat generated from an LED chip thereof, and a backlight unit including the same are disclosed. The LED module includes a base made of a metal material, an insulating layer provided on the base, a circuit layer provided on the insulating layer, an LED package provided on the circuit layer, and a bonding layer extending through the insulating layer and the circuit layer, to connect the LED package to the base.
Public/Granted literature
- US20120294042A1 LED MODULE, BACKLIGHT UNIT INCLUDING THE LED MODULE, AND METHOD FOR MANUFACTURING THE LED MODULE Public/Granted day:2012-11-22
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