Invention Grant
- Patent Title: Light-emitting element mounting package, light-emitting element package, and method of manufacturing these
- Patent Title (中): 发光元件安装封装，发光元件封装及其制造方法
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Application No.: US13710648Application Date: 2012-12-11
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Publication No.: US08952408B2Publication Date: 2015-02-10
- Inventor: Tatsuaki Denda , Kazutaka Kobayashi
- Applicant: Shinko Electric Industries Co., Ltd.
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: IPUSA, PLLC
- Priority: JP2011-277737 20111219; JP2012-238318 20121029
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/60 ; H05K1/02 ; H01L21/50 ; H05K1/11
Abstract:
A light-emitting element mounting package includes a light-emitting element mounting portion that includes a plurality of wiring portions arranged interposing a predetermined gap between the wiring portions facing each other, and an insulating layer on which the light-emitting element mounting portion is mounted, wherein an upper surface of the light-emitting element mounting portion is exposed on the insulating layer, wherein cutout portions are formed on lower sides of side edges of the wiring portions and contact the insulating layer.
Public/Granted literature
Information query
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